The simulation tool developed by Helmut Schreiber of TU Graz for the transponder occupancy in Austrian airspace is now being further developed for European airspace.…
View More Aircraft in radio contact: Developing simulation tools for transponder occupancyCategory: Hardware
AI light-field camera reads 3D facial expressions
Credit: CC0 Public Domain A joint research team led by Professors Ki-Hun Jeong and Doheon Lee from the KAIST Department of Bio and Brain Engineering…
View More AI light-field camera reads 3D facial expressionsDeveloping an ultra-scalable artificial synapse
Brain-inspired device used for integrating both silent and functional synapses. Credit: SUTD A research team, led by Assistant Professor Desmond Loke from the Singapore University…
View More Developing an ultra-scalable artificial synapseWalking in a 360° video with foot vibrations for seated observers
The virtual walking system. Credit: Toyohashi University of Technology. Walking is a basic human activity that improves human physical and mental health. However, physical disabilities…
View More Walking in a 360° video with foot vibrations for seated observersResearchers developed DIY 3D-printed peristaltic pump kits for microfluidics
To make microfluidic pumps more accessible to the scientific community, SUTD researchers developed a highly-customisable, 3D-printed peristaltic pump kit, where users from around the world…
View More Researchers developed DIY 3D-printed peristaltic pump kits for microfluidicsIBM and Samsung team up to design vertical transport field effect transistors
Credit: CC0 Public Domain Officials from IBM and Samsung announced at this year’s IEDM conference in San Francisco a collaboration on a new chip design…
View More IBM and Samsung team up to design vertical transport field effect transistorsMagnetic domain wall devices closer to industrial reality
Figure 1: Schematics of (top) a domain wall device where data can be stored, but also transported fully electrically; (bottom) envisaged applications, from left to…
View More Magnetic domain wall devices closer to industrial realityBenefits of 3D-SOC design and backside interconnects for future high-performance systems
Figure 1: Abstracted view of a possible future high-performance system. High-performance die with 3D-SOC stacked memory are implemented on an active interposer chip which acts…
View More Benefits of 3D-SOC design and backside interconnects for future high-performance systemsCaught on camera: Using AI to combat street crime
Credit: Pixabay/CC0 Public Domain According to the Overseas Security Advisory Council (OSAC) Malaysia 2020 Crime and Safety Report, common crimes in Malaysia include snatch thefts…
View More Caught on camera: Using AI to combat street crimeSerious security vulnerabilities in DRAM memory devices
A few of the DRAM memory modules tested by the ETH researchers. Credit: ETH Zurich / Computer Security Group Researchers at ETH Zurich have discovered…
View More Serious security vulnerabilities in DRAM memory devices