Researchers at The University of Tokyo demonstrate enhanced radiative heat transfer across a gap between two micro-sized silicon plates by coating them with a layer of silicon dioxide, which may significantly improve heat management of computers. Credit: Institute of Industrial Science, The University of Tokyo

Japanese researchers have enhanced heat dissipation in nanodevices by adding a silicon dioxide coating to silicon structures, potentially revolutionizing the design and efficiency of future electronic devices.

Researchers from Japan have been working hard to keep their cool—or at least—keep their nanodevices from overheating. By adding a tiny coating of silicon dioxide to micro-sized silicon structures, they were able to show a significant increase in the rate of heat dissipated. This work may lead to smaller and cheaper electronic devices that can pack in more microcircuits.

As consumer electronics become ever more compact, while still boasting increased processing power, the need to manage waste heat from microcircuits has grown to become a major concern. Some scientific instruments and